HDI Reduce PCB
PCBs are used in a wide variety of electronic products that require excellent performance and space utilization. These include mobile/cellular phones, touch-screen devices, laptop computers, digital cameras, 4/5G network communications and military applications such as avionics and smart weapons. They are also commonly employed in industrial automation, which requires extensive computerization to relay information and optimize operations.
The underlying pcb hdi material and the fabrication process determines the overall size of a circuit board, which in turn dictates how many layers are required to construct it. HDI increases density by using finer tracks and microvias to reduce the amount of space needed on the surface of the PCB. This allows more technology to be placed on the same board, reducing its footprint and requiring fewer layers for assembly.
However, the small size of the components makes it harder to route signals to the correct destination. It’s therefore crucial to plan the component placement with the help of a good DFM (design for manufacturing) tool and a knowledgeable PCB supplier. This is especially important when working with ultra-thin components, which can’t be accomodated by the traditional PCB routing tools.
How Does HDI Reduce PCB Footprint?
An HDI circuit board requires a more complex manufacturing process than a standard one, as it’s usually a multi-layer board with densely routed layers. Several processes and special equipment are necessary for production, including laser drilling of the small microvias that provide connectivity to other layers. These vias can be buried or staggered, and can be either blind or plated. The latter is preferable for high-reliability designs because of its superior reliability compared to the standard through-hole (through-hole) hole.
In addition to the higher densities, HDI circuit boards have the advantage of shorter signal transmission distances. This translates to reduced power losses and lower transmission delays. The small sizes of these components also make them less susceptible to mechanical damage and environmental conditions.
As a result, HDI circuit boards are ideal for applications that are exposed to harsh environments and physical impacts. Their robust construction and compact design allow them to withstand extreme temperatures, humidity levels, electromagnetic interference and physical shocks.
The manufacturing process of HDI boards can be quite time-consuming because of the complexity and specialized equipment involved. This can increase the cost of the final product, but it’s worth the investment because of the advantages it offers over conventional circuit boards.
