Can High Density Interconnects Be Used
The ability to pack more components into a smaller space is a key technology that has elevated modern electronic devices. These compact circuit boards are more efficient, use less power and offer higher frequencies than traditional options. They can also handle more shocks and vibration, making them ideal for mobile devices and other handheld technologies. The use of high density interconnect has even extended to submarines and other underwater applications, where the need for reliable connectivity is critical.
A basic submarine cable is composed of metal wires that carry electrical signals through a core sheathed in protective insulation. Submarine cables are often used to move data between land-based servers and other facilities. In some cases, they can also be utilized to send optical data through the ocean’s deepest reaches, such as for internet traffic.
When creating these submarine cables, high density interconnect manufacturers need to ensure that the copper conductors and other parts are able to withstand a range of environmental conditions. To accomplish this, they must choose materials that provide excellent thermal stability. In addition, they must consider the resistance to chemical corrosion, mechanical shock and explosive stress.
Can High Density Interconnects Be Used in Underwater Applications?
High density interconnect is one of the most effective ways to achieve these demands. It utilizes multiple layers of copper that are plated unswervingly to the surface of the board to ensure optimal heat dissipation. This means that the system will remain functional, even in challenging operating conditions.
To ensure optimum performance, a high density interconnect PCB must be manufactured using the highest quality base materials. These materials are often halogen-free to eliminate the risk of corrosion in harsh environments. They also feature ultra-low loss, which improves the performance of the entire circuit board.
The high-density PCB will also have an increased number of blind and buried vias, which are small holes that cannot be seen from the surface of the device. They are used to connect the peripheral layer of the PCB with the inner layer. The benefit of this is that the design engineer can route signal traces and power/ground connections without having to drill through the outer layer of the board.
In addition to the increased density, a high-density PCB will have reduced power consumption and a decrease in crossing delays and signal losses. This enables better communication between components and a more effective system.
Fischer Connectors is a manufacturer of high-density connectors for UUVs and other surface or underwater remotely operated vehicles (ROVs). Its products are dry-mate and are depth-rated to 10,000 psi, making them ideal for naval and defense, deep-sea oil and gas exploration, and pipeline inspection. Its Millennium Series contains high-density connectors with hybrid contact configurations that are capable of surviving a range of underwater conditions. The company’s UUV product solutions are based on their ability to meet requirements for contact resistance, high pin density and size, and mixed power/signal contact configurations. These parameters are essential for ensuring that the connectors can withstand the high levels of shock and pressure encountered in these applications.
